XCE specialize in manufacturing various hi-frequency PCB and multilayer board including fastest sample products. Provides you with a unique one stop solution to all your printed circuit needs, including PCB manufacturing and assembly.
Radar microwave circuit board (PCB) production,Doppler sensor module LED light board,5.8G,24G sensor board, speed electronic dog motherboard,Rogeros high frequency board,Taconic high frequency board, TP-2 special media board,Board,F4B domestic high-frequency board,Rogeros and FR4 mixing plate,4G antenna high frequency board,4G base station high frequency board.
Highlights:
Rigid PCB–2 Layer to 48 Layers
Blind/buried via
Backplane
High Density Interconnects (HDI)
Board thickness 8mm
Maximum copper thickness 8 oz
PCB surface finish:
HASL
Leadfree HASL
OSP
ENIG Immersion Gold
Immersion tin
Flash gold
Laminate Materials:
FR4 Normal and high-TG
Rogers
Taconic
Isola
F4B
Special requirements:
Peelable solder mask
Carbon ink
Buried capacitor/resistor
Quality Standard certifications:
ISO9001
QS9000
ISO14001
TS16949
AS9100
UL Underwriter Laboratories
| IPC-600 Class 2 |
Standard manufacturing specifications |
| IPC-600 Class 3 |
Available as required |
| IPC-6012 |
Available as required with in-house testing capabilities |
| Inner layer pads |
025″ / 0.635mm oversize minimum |
| Smallest finished via |
.004″ / 0.102mm |
| Standard pad size (.002″/ 0.051mm annular ring) |
0085″ / 0.216mm annular ring (.017″ / 0.432mm oversize) |
| Smallest pad size (.001″ / 0.025mm annular ring) |
.0075″ / 0.191mm annular ring (.015″ / 0.038mm oversize) |
| Standard line and spacing |
.005″ / .005″ (0.127mm / 0.127mm) |
| Special line and spacing |
.003″ / .003″ (0.076mm / 0.076mm) |
Product Tags:
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Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects Images
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