HDI High TG 24 multilayer immerison gold Inner 0.5oz outer 1oz PCB board
| Material:FR4 | Soldermask:Green |
| Molde Number:xcepcb0011 | Silkscreen:White |
| Layer:24 | Panel Size:75*105mm |
| Board Thickness:1.6mm | Package Details: Inner:Vacuum-packed Bubble bag With Foam Outer:Carton Box |
| Min Line Space:4Mil |
| Min Line Width:4Mil |
| Min Hole Size:12Mil |
| Finished Surface:ENIG | Special requirement: Provide Slice report Provide shipment report |
| Finished Copper:1oz |
| Delivery Time:8 Days |
Parameter
| Profile tolerance | ±0.10mm(4mil)c |
| Board bend&warp | ≤0.7% |
| Insulation resistance | ＞1012Ωnormal |
| Through-hole resistance | ＜300Ωnormal |
| Electric strength | ＞1.3kv/mm |
| Current breakdown | 10A |
| Peel strength | 1.4N/mm |
| Soldmask regidity | ＞6H |
| Thermal stress | 288℃20Sec |
| Testing voltage | 50-300v |
| Min buried blind via | 0.2mm(8mil) |
| Outer cooper thickness | 1oz-5oz |
| Inner cooper thickness | 1/2 oz-4oz |
| Aspect ratio | 8:1 |
| SMT min green oil width | 0.08mm |
| Min green oil open window | 0.05mm |
| Insulation layer thickness | 0.075mm-5mm |
| Aperture | 0.2mm-0.6mm |
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB |
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating |
| Laminate |
| Technology Index | Mass production | Middle and Small Volume | Prototype |
| FR4 | Normal Tg | S1141 (Not Recommander for HF ) |
| Middle Tg | S1000H(HDI, Mul-layer Board)) |
| High Tg | S1000-2M, IT180A(Heavy Copper, Multi-Layer Board) |
| Halogen Free | Middle Tg | S1150g |
| High Tg | s1165 |
| Ceramics Filled High Frequency Board | Rogers series,Arlon Series,Toconic Series,Taizhou Lin Wang |
| Special PP | Low Flow PP, Arlon 49N |
| Ceramic Filled, Rogers4450, Arlon25FR |
| PTFE PP, Arlon 6700,Taconic FR-27 |
| Rigid PI | Arlon 85N,Shenyi SH260 |
| Metal-Substrate | Bercquist AL Substrate, Copper Substrate |
| Pure Ceramics Material | N/A |
| Note: For other material not involed, We can purchase or help to purchase for customers special requirements. |
| Technology Index | Mass production | Middle and Small Volume | Prototype |
| Layer | FR4 Series | 20 | 28 | 36 |
| Rigid Flex/Flex | 6(4) | 10(8) | 16(12) |
| High Frequency Hibrid Laminate | 12 | 18 | 24 |
| Pure PEFE | 4 | 8 | 12 |
| Metal Core | 2 | 4 | 4 |
Some more case:
About us:
Xinchenger, have commited to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station.
Our advantage:
1, The industry’s top materials business High TG, FR4, high frequency(Rogers,Teflon, ARLON, TYCONIC),Long-term cooperation.
2, Advanced technology
min/T/G:3/3 mil
min CMC hole: 0.15mm
min line width: 5um(3um available)
MAX aspect ratio for board thickness vs drill bit size 15:1
3, Our unique one stop solution to all printed circuit needs, PCB &PCBA assembly service and component procument
4, Quality control:
AOI Testing
X-Ray Inspection
In-Circuit Testing
Product Tags:
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FR4 High TG F4B HDI 94v0 High Frequency PCB HDI Immersion Gold Board High Density Interconnect Images
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