2OZ Immersion Tin High Frequency pcb double layer 0.79mm Thickness Blue Soldermask
Electronic equipment is the development trend of high-frequency, especially in the wireless network, the growing development of satellite communications, information products to high
Speed and high-frequency, and communications products to the capacity of large-speed wireless transmission of voice, video and data standardization.
Of the new generation products need high-frequency substrate, satellite systems, mobile phone base stations and other communications products must be used to receive high-frequency circuit
Board, in the next few years will inevitably rapid development of high-frequency substrate will be a lot of demand.
Advantage
F4B High Frequency PCB Double Layer 0.79mm Thickness Blue Soldermask
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
Choosing high frequency pcb material :
Selecting a circuit material for a high-frequency printed-circuit board(pcb) is generally a trade-off,
often between price and performance.However,PCB materials are also selected by two key factors:
how well they meet the needs of an end-use application
and what kind of efforts is required to fabricate a desired circuit with a particular material.
These two factors may not mesh:one material may be well suited for a particular application
but may pose challenges in terms of circuit fabrication,and vice verse.
There is no foolproof,step by step procedure for selecting a PCB material.
But by relying on some tangible guildelines designed to evaluate a material in terms of its suitability
for circuit fabrication and for meeting the requirements of an application,
the process of selecting a PCB for a particaular application can be simplied.
Parameter:
| o |
Item |
Data |
| 1 |
Layer: |
1 to 24 layers |
| 2 |
Material type: |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 |
Board thickness: |
0.20mm to 3.4mm |
| 4 |
Copper thickness: |
0.5 OZ to 4 OZ |
| 5 |
Copper thickness in hole: |
>25.0 um (>1mil) |
| 6 |
Max. Board Size: |
(580mm×1200mm) |
| 7 |
Min. Drilled Hole Size: |
4mil(0.1mm) |
| 8 |
Min. Line Width: |
3mil (0.075mm) |
| 9 |
Min. Line Spacing: |
3mil (0.075mm) |
| 10 |
Surface finishing: |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 |
Solder Mask Color: |
Green/Yellow/Black/White/Red/Blue |
| 12 |
Shape tolerance: |
±0.13 |
| 13 |
Hole tolerance: |
PTH: ±0.076 NPTH: ±0.05 |
| 14 |
Package: |
Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 |
Certificate: |
UL,SGS,ISO 9001:2008 |
| 16 |
Special requirements: |
Buried and blind vias+controlled impedance +BGA |
| 17 |
Profiling: |
Punching, Routing, V-CUT, Beveling |
Rogers material in stock:
| Brand |
Model |
Thickness(mm) |
DK(ER) |
| F4B |
F4B |
0.38 |
2.2 |
| F4B |
0.55 |
2.23 |
| F4B |
0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 |
2.65 |
| F4Bk |
0.8,1.5 |
2.65 |
| F4B |
0.8 |
3.5 |
| FE=F4BM |
1 |
2.2 |
| Rogers |
RO4003 |
0.254 0.508,0.813,1.524 |
3.38 |
| RO4350 |
0.254 0.508,0.762,1.524 |
3.5 |
| RO5880 |
0.254.0.508.0.762 |
2.2 |
| RO3003 |
0.127,0.508,0.762,1.524 |
3 |
| RO3010 |
0.635 |
10.2 |
| RO3206 |
0.635MM |
10.2 |
| R03035 |
0.508MM |
3.5 |
| RO6010 |
0.635MM, 1,27MM |
10.2 |
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb
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