Multilayer High Frequency RF Microwave F4B Pcb Board 0.38 MM ER = 2.2
Products Details
We are the highest efficience pcb manufature here .
(1) Professional Manufacturer on PCB for about 10 years
(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.
(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification
| Feature |
Parameter (in) |
| Surface processing |
Lead- Free HASL/Plating gold / immersion gold /Plating gold finger/OSP |
| Layers |
1~24 layers |
| Copper Thickness |
O.5OZ~10OZ |
| Board Thickness Range |
14~276mil |
| Min Hole Size |
3mil |
| Impedance Control |
±5% |
| Flammability |
94V-0 |
| Warp & Twist |
≦0.7% |
| Thermal Shock |
5×10Sec@288 |
| Aspect Radio |
18:1 |
| Min Line Width/Space |
2mil /2mil |
| PTH Dia. Tolerance |
±2mil |
| NPTH Dia. Tolerance |
±1mil |
| Hole Position Deviation |
±3mil |
| Outline Tolerance |
±4mil |
| S/M Pitch |
3mil |
| HDI Capability |
Any layer |
OME Manufature
a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.
b. Expert circuit board testing, high quality factory wholesale price
c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS
We offer our customers a wide range material and boards:
1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB
2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available
3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)
4. Aluminum PCB board thickness from 0.8mm-3.6mm
5. Quantity from prototype to volume production
6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing
| Raw Material |
F4B |
| Layer Count |
Multilayer |
| Board Thickness |
0.38 mm |
| Copper Thickness |
2 oz |
| Surface Finish |
Immersion Gold Over Nickle |
| Solder Mask |
Green |
| Silkscreen |
White |
| Min. Trace Width/Spacing |
0.075/0.075mm |
| Min. Hole Size |
0.25mm |
| Hole Wall Copper Thickness |
≥20μm |
| Measurement |
210*210mm |
| Packaging |
Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps |
| Application |
Communication,automobile,cell,computer,medical |
| Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable |
| Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PrePreg Material
| Parameter |
Value |
| Specific gravity/density |
1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption |
−0.125 in < 0.10% |
| Temperature index |
140 °C (284 °F) |
| Thermal conductivity, through-plane |
0.29 W/(m·K), 0.343 W/(m·K) |
| Thermal conductivity, in-plane |
0.81 W/(m·K), 1.059 W/(m·K) |
| Rockwell hardness |
110 M scale |
| Bond strength |
> 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW |
> 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW |
> 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW |
> 310 MPa (45,000 psi) |
| Izod impact strength - LW |
> 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW |
> 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise |
> 415 MPa (60,200 psi) |
| Dielectric breakdown (A) |
> 50 kV |
| Dielectric breakdown (D48/50) |
> 50 kV |
| Dielectric strength |
20 MV/m |
| Relative permittivity (A) |
4.8 |
| Relative permittivity (D24/23) |
4.8 |
| Dissipation factor (A) |
0.017 |
| Dissipation factor (D24/23) |
0.018 |
| Dielectric constant permittivity |
4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature |
Can vary, but is over 120 °C |
| Young's modulus - LW |
3.5×106 psi (24 GPa) |
| Young's modulus - CW |
3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis |
1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis |
1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis |
7.0×10−5 K−1 |
| Poisson's ratio - LW |
0.136 |
| Poisson's ratio - CW |
0.118 |
| LW sound speed |
3602 m/s |
| SW sound speed |
3369 m/s |
| LW Acoustic impedance |
6.64 MRayl |
Compared Data :
| |
Model |
ER |
Tanδ@ 1GHz |
Cter (ppm/℃) |
CTE (X,Y)
(ppm/℃)
|
| FR4 |
Normal |
4.6 |
0.030 |
17 |
|
| FR4 |
PCL370(FR4-HTG) |
4.3 |
0.0015 |
51 |
17 |
| FR4 |
117 (FR4-HTG) |
4.4 |
0.013 |
|
17 |
| Park Neclo |
N4000-6-FC BC (FR4-HTG) |
4.1 |
0.0015 |
|
16 |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Product Tags:
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Multilayer RF PCB High Frequency , Microwave F4B Pcb Board 0.38 MM ER = 2.2 Images
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