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Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service

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Shenzhen Xinchenger Electronic Co.,Ltd

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Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service

Brand Name : XCE

Model Number : XCER

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : SHENGYI

Layer : 4

Color : Green

Min line space : 3mil

Min line width : 3mil

Copper thickness : 1OZ

Board size : 7*8cm

Panel : 4*2

Surface : Lead free HASL

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Rigid PCB Circuit Board Fabrication Prototype Service With Vias Plug Filled

Origin:China	Special: vias filled and capped
Layer:4	Thickness:1.524mm
Surface: Hasl	Hole:0.8

Specification:

• Polyimidemprodesu-highennalperfonnanwith
Tg>2C (TMA)Td >405C%1 sTGAa)nd T300>60min.
• Lω'erZs CTE of 1.20% ( 50-260C) offering superior PTH reliability.
• Maini mechani 1 strength and bonding sngth at high temperature.
• Tough resin systemNon-MOAemist
• Haelfrree chemistry mpatible withe1 pro sslng.
RoHSJWEEE mpliant.
• IPC4101D.0/41

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.

Parameter:

o	Item	Data
1	Layer:	1 to 24 layers
2	Material type:	FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3	Board thickness:	0.20mm to 3.4mm
4	Copper thickness:	0.5 OZ to 4 OZ
5	Copper thickness in hole:	>25.0 um (>1mil)
6	Max. Board Size:	(580mm×1200mm)
7	Min. Drilled Hole Size:	4mil(0.1mm)
8	Min. Line Width:	3mil (0.075mm)
9	Min. Line Spacing:	3mil (0.075mm)
10	Surface finishing:	HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11	Solder Mask Color:	Green/Yellow/Black/White/Red/Blue
12	Shape tolerance:	±0.13
13	Hole tolerance:	PTH: ±0.076 NPTH: ±0.05
14	Package:	Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15	Certificate:	UL,SGS,ISO 9001:2008
16	Special requirements:	Buried and blind vias+controlled impedance +BGA
17	Profiling:	Punching, Routing, V-CUT, Beveling

Features

CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
ER = 3.38/3.48 at 10.0 GHz
ER is constant to 40.0 GHz
ED (electro-deposited) copper only
Layer-to-layer thickness control = +/- 0.001
Fabrication costs are typical to slightly increased

Vias Plug Filled Rigid PCB Circuit Board Fabrication Prototype Service

Product Tags:

printed pcb board

printed circuit board pcb

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