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Multilayer Fr4 PCB High TG With Gold Plating Surface Finish

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Shenzhen Xinchenger Electronic Co.,Ltd

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Multilayer Fr4 PCB High TG With Gold Plating Surface Finish

Brand Name : XCE

Model Number : XCE BG520

Certification : CE,ROHS,FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : MOQ 1 Piece

Price : Negotiation

Payment Terms : T/T, Western Union

Supply Ability : 1000000 pieces per week

Delivery Time : 5-10 working days

Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package

Color : Yellow

Material : Fr4 Material

Layer : Multilayer

Board Size : 12*6cm

Copper Thinknes : 1 oz

Min Line Width : 5 mil

Min Line Space : 5 mil

Surface Finish : Immersion Silver

Name : FR4 pcb

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Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Quick Detail :
1. Type : Pcb
2. Material : Fr4
3. Layer : Multilayer
4. Products Size :12*6cm
5. Permittivity : 3
6. Surface finish : Gold Plating

Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 3 dielectric conductivity much more precision .

Description :
Most printed circuit boards are manufactured using glass-reinforced epoxy laminate as the substrate. While there are a wide variety of laminates available on the market, FR-4 is both versatile and well-accepted as a standard material for PCB manufacture. FR-4 functions well as an electrical insulator, and has a good strength-to-weight ratio, and is flame resistant.
The standard FR-4 material that is used in our PCBExpress^® Quickturn, ValueProto^® and the default material for our PCBpro^® Full Feature products is a high temperature, high T_d, low CTE 150T_g material.
If a higher T_g material is required, we do stock a 170T_g version of our standard FR-4 material as well, that can be substituted in our PCBpro Full Feature and Custom Quote products (provide a readme file or a print note specifying the 170 T_g material). There may be a material lead time for some specific sizes or thickness, and may impact due date.

Key Benefits:

High dielectric constant for circuit size reduction
Low loss. Ideal for operating at X-band or below
Tight εr and thickness control for repeatable circuit performance

Typical Applications:

Space Saving Circuitry
Patch Antennas
Satellite Communications Systems
Power Amplifiers
Aircraft Collision Avoidance Systems
Ground Radar Warning Systems

Production Description :

Parameter	Value
Speciﬁc gravity/density	1.850 g/cm³ (3,118 lb/cu yd)
Water absorption	−0.125 in < 0.10%
Temperature index	140 °C (284 °F)
Thermal conductivity, through-plane	0.29 W/(m·K),^[1] 0.343 W/(m·K)^[2]
Thermal conductivity, in-plane	0.81 W/(m·K),^[1] 1.059 W/(m·K)^[2]
Rockwell hardness	110 M scale
Bond strength	> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW	> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW	> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW	> 310 MPa (45,000 psi)
Izod impact strength - LW	> 54 J/m (10 ft·lb/in)
Izod impact strength - CW	> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise	> 415 MPa (60,200 psi)
Dielectric breakdown (A)	> 50 kV
Dielectric breakdown (D48/50)	> 50 kV
Dielectric strength	20 MV/m
Relative permittivity (A)	4.8
Relative permittivity (D24/23)	4.8
Dissipation factor (A)	0.017
Dissipation factor (D24/23)	0.018
Dielectric constant permittivity	4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature	Can vary, but is over 120 °C
Young's modulus - LW	3.5×10⁶ psi (24 GPa)
Young's modulus - CW	3.0×10⁶ psi (21 GPa)
Coefficient of thermal expansion - x-axis	1.4×10⁻⁵ K⁻¹
Coefficient of thermal expansion - y-axis	1.2×10⁻⁵ K⁻¹
Coefficient of thermal expansion - z-axis	7.0×10⁻⁵ K⁻¹
Poisson's ratio - LW	0.136
Poisson's ratio - CW	0.118
LW sound speed	3602 m/s
SW sound speed	3369 m/s

Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Product Tags:

multilayer pcb fabrication

multilayer pcb manufacturing

Multilayer Fr4 PCB High TG With Gold Plating Surface Finish Images

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