Multilayer High Frequency Pcb With Lead-free Hasl In MMRFIC Feild
Quick Detail :
| Type |
Pcb |
| Material |
Rogers |
| Layer |
Multilayer |
| Size |
10*5cm |
| Permittivity |
3 |
| Color |
Green |
| Surface Finish |
Lead-free Hasl |
Features:
Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products . Immersion gold surface finish make the pcb 's conductive performance enhancements. Multilayer pcb design ,the precision of the pcb improves much more better . Low dielectric : 3 dielectric conductivity much more precision .
Parameter:
| Model |
Parameter |
thickness(mm) |
Permittivity(ER) |
| Rogers |
RO5880 |
0.254 0.508 0.762 |
2.20 ± 0.02 |
| RO4350 |
0.254 0.508,0.8,1.524 |
3.5 |
| RO6010 |
0.635 1.27 |
10.2 |
| RO3003 |
0.127 0.254 0.508 0.762 1.524 |
3 |
| RO3010 |
0.254 0.508 0.635 0.762 |
10.2 |
| RO3035 |
0.508 |
3.5 |
| RO4003 |
0.508 |
3.38 |
Description :
RT/duroid® 6006 & 6010 Laminates
RT/duroid® 6006 microwave laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2.
RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. They have tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.
RT/duroid 6006 laminates are supplied clad both sides with ¼ oz. to 2 oz./ft2 (8.5 to 70 μm) electrodeposited copper foil. Cladding with rolled copper foil is also available. Thick aluminum, brass, or copper plate on one side may be specified.
High Thermal Performance
-
Tg of 200 (DSC), 230°C (DMA)
-
Low CTE for reliability
-
Lead-free Compatible & Rhos Complaint
-
UV Blocking and AOI Fluorescence
-
Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat
Key Benefits:
- High dielectric constant for circuit size reduction
- Low loss. Ideal for operating at X-band or below
- Tight εr and thickness control for repeatable circuit performance
Typical Applications:
- Space Saving Circuitry
- Patch Antennas
- Satellite Communications Systems
- Power Amplifiers
- Aircraft Collision Avoidance Systems
- Ground Radar Warning Systems
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
Production Description :
| Parameter |
Value |
| Specific gravity/density |
1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption |
−0.125 in < 0.10% |
| Temperature index |
140 °C (284 °F) |
| Thermal conductivity, through-plane |
0.29 W/(m·K),[1] 0.343 W/(m·K)[2] |
| Thermal conductivity, in-plane |
0.81 W/(m·K),[1] 1.059 W/(m·K)[2] |
| Rockwell hardness |
110 M scale |
| Bond strength |
> 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW |
> 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW |
> 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW |
> 310 MPa (45,000 psi) |
| Izod impact strength - LW |
> 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW |
> 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise |
> 415 MPa (60,200 psi) |
| Dielectric breakdown (A) |
> 50 kV |
| Dielectric breakdown (D48/50) |
> 50 kV |
| Dielectric strength |
20 MV/m |
| Relative permittivity (A) |
4.8 |
| Relative permittivity (D24/23) |
4.8 |
| Dissipation factor (A) |
0.017 |
| Dissipation factor (D24/23) |
0.018 |
| Dielectric constant permittivity |
4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature |
Can vary, but is over 120 °C |
| Young's modulus - LW |
3.5×106 psi (24 GPa) |
| Young's modulus - CW |
3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis |
1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis |
1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis |
7.0×10−5 K−1 |
| Poisson's ratio - LW |
0.136 |
| Poisson's ratio - CW |
0.118 |
| LW sound speed |
3602 m/s |
| SW sound speed |
3369 m/s |
|
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Product Tags:
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Multilayer High Frequency Pcb With Lead free Hasl In MMRFIC Feild Images
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