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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Rigid FR4 Multilayer PCB Board Manufacturing Process 20 Layer With UL Rohs CE SGS Certification

Shenzhen Xinchenger Electronic Co.,Ltd
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Rigid FR4 Multilayer PCB Board Manufacturing Process 20 Layer With UL Rohs CE SGS Certification

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Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Layer of number : 20

Surface finish : Immersion gold

Base material : FR4

Size : 18*5cm

Board THK : 1.8mm

Product name : multilayer pcb

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20 Layer PCB Multilayer Circuit Board With UL Rohs CE SGS Certification

Specification:

Brand XCE
Layer 20
Model XCEM
Board THK 1.8MM
Surface finish Immersion gold
Size 180*50mm
Copper THK 1.5oz
Origin Shenzhen

Quick detail:

  • Base material: FR4
  • Color:Green solder mask,
  • Color:white silk screen
  • Packaging Details:Follow customer's spec.
  • Delivery Detail:within 7 days
  • Certificate:ISO9001, UL,ISO14001,SGS

Description:

we have accumulated abandunt experiences in the line of high frequency microwave business for

which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,

4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as

Rogers,

TACONIC,Arlon,Isola,F4B,TP2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies

like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers

with high quality.furthermore,we also keen on helping customers shorten the period of production

development and 24 hours of sample service is available.

Parameter:

PCB General Manufacturing Capabilities:

No. of Layer

Up to 40 layers

Material

FR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High Tg

RCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency Rogers

CEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum Base

Min. Width/Spacing

50um/50um

Copper Thickness

1/3~12oz (12~420um)

Thickness

0.1~6.0mm (0.004’’~0.240’’)

Min. Hole Spacing

PTH (Plated Through Hole)

0.10mm (0.004’’)

NPTH (Non Plated Through Hole)

0.10mm (0.004’’)

Surface Finish

HASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion Silver

Nickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.

Special Processing Board

Copper plate edge, Sink hole, Tear ink, FPC

Advantage:

Sufficient rogers material raw,promopt response and delivery time.

Crossed blind vias is available

Why choose us:

15 years experience in PCB manufacturing

ISO9001, TS16949, UL Approval and RoHS compliant

One stop solution for PCB design, quick-turn prototyping, components sourcing, SMT & Through-hole assembly, Functional testing, Enclosure assembly.

Full Range of Testing Services: Visual and AOI Inspection, In Circuit Testing, X-Ray for BGA and Functional Testing.

Small to medium volume to production level quantities.

NDA (NON-DISCLOSURE AGREEMENT) is provided to sign for the confidentiality of your design


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